Product name: TO and SMD type packages for transistor device

Applications: automatic control of machinery and electrical appliances in the fields of home appliances, automobiles, ships, motor cars, power electronics, etc.

Product characteristics: The external dimensions meet the JEDE standard, and the glass or ceramic air-tight connection is used. It is suitable for insertion and surface mounting. Parallel seam welding or energy storage welding can be used for cover (cap) sealing , the surface is nickel-plated and gold-plated, differential plating areas, differential gold and nickel plating thickness, good heat dissipation, good hermeticity and high reliability.

Technical characteristics

Base material: Low carbon steel, Kovar ceramic, tungsten copper, etc.

Lead material: Kovar, Kovar copper, copper alloy, etc.

Thermal conductivity of base plate: ＞150W/m.K

Air tightness: ≤1x10^-3Pa.cm³/s (He)

Plating: Ni/Au

Reliability: Meets MIL-883 requirements

Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facilities, JOPTEC now covers an area of 21,000 square meters and has developed a complete and mature process for the design, manufacturing, testing and quality inspection for hermetic metal-glass packages. Over the past few decades, JOPTEC’s capability, quality consistency and reliability have been recognized by customers worldwide that range from major international companies of high power laser, optical communication, defense and aerospace agencies to medical and research establishments.