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Unusual Lead FormingExtended Bottom ICR Hermetic Packages

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JOPTEC LASER CO., LTD

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Unusual Lead FormingExtended Bottom ICR Hermetic Packages

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Unusual Lead FormingExtended Bottom ICR Hermetic Packages

Main performance parameters Application fields: ICR package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...

Product Tags:

0.45μm Gold plating Hermetic Package

ICR hermetically sealed packaging

optimal function Hermetic electronic packages

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